IEEE ISORC 2019 PROGRAM COMMITTEE
IEEE ISORC 2019 is pleased to announce a truly international Technical Program Committee (TPC), comprised of domain experts from across the world. Each member of the TPC reviews paper submissions to ensure the continued high standard of ISORC.
Kyoungho An
Real-Time Innovations, USA
Lars Bauer
Karlsruhe Institute of Technology, Germany
Enrico Bini
University of Turin, Italy
Che-Wei Chang
Chang Gung University, Taiwan
Wanli Chang
University of York, UK
Oliver Chen
Technical University of Munich, Germany
Xianzhang Chen
Chongqing University, China
Ya-Shu Chen
National Taiwan University of Science and Technology, Taiwan
Miguel A. De Migue
Universidad Politécnica de Madrid, Spain
Manuel Diaz
University of Malaga, Spain
Christian Esposito
University of Napoli "Federico II", Italy
Aniruddha Gokhale
Vanderbilt University, USA
Ian Gray
University of York, UK
Zonghua Gu
Umeå University, Sweden
Nan Guan
The Hong Kong Polytechnic University, China
J. Javier Gutiérrez
Universidad de Cantabria, Spain
Akram Hakiri
LAAS-CNRS, France
M. Teresa Higuera Toledano
Universidad Complutense de Madrid, Spain
Wei Jiang
University of Electronic Science and Technology of China, China
Xu Jiang
Beihang University, China
Taylor T Johnson
Vanderbilt University, USA
Vana Kalogeraki
Athens University of Economics and Business, Greece
Gabor Karsai
Vanderbilt University, USA
Mohammad Khan
University of Connecticut, USA
Fanxin Kong
University of Victoria, Canada
Jing Li
New Jersey Institute of Technology, USA
Di Liu
Yunnan University, China
Weichen Liu
Nanyang Technological University, Singapore
Saad Mubeen
Mälardalen University, Sweden
Himanshu Neema
Vanderbilt University, USA
Roman Obermaisser
University of Siegen, Germany
Mathias Pacher
Goethe Universität Frankfurt am Main, Germany
Paulo Pedreiras
University of Aveiro, Portugal
Andreas Polze
Hasso-Plattner-Institute at University Potsdam, Germany
Mohammad Rahman
Tennessee Tech University, USA
Abusayeed Saifullah
Wayne State University, USA
Martin Schoeberl
Technical University of Denmark, Denmark
Bran Selic
Malina Software Corp.
Shashank Shekhar
Siemens Corporate Technology
Hongyang Sun
Vanderbilt University, USA
Eduardo Tovar
Polytechnic Institute of Porto, Portugal
Sascha Uhrig
Airbus Defense and Space GmbH
Tullio Vardanega
University of Padua, Italy
Meng Xu
University of Pennsylvania, USA
Kecheng Yang
Texas State University, USA
Laurence T. Yang
St Francis Xavier University, Canada
Jinyu Zhan
University of Science and Technology of China, China